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- Reduced packaging with lower CO2 footprint
- Package contains 20g thermal compound with up to 8 years' durability
- 8.5 W/(mK) thermal conductivity / 870 poise viscosity
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- High-performance thermal compound
- Easy to apply, delivered in convenient syringe containing 4g of thermal paste
- 20% better performance than previous editions
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- High-performance thermal compound
- Easy to apply, delivered in convenient syringe containing 8g of thermal paste
- 20% better performance than previous editions
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- Reduced packaging with lower CO2 footprint
- Package contains 4g thermal compound with up to 8 years' durability
- 8.5 W/(mK) thermal conductivity / 870 poise viscosity
Ships in 4 days
IN STOCK - ships in 4 days
At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 4 days from your order.
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- Compatible with Intel & AMD Sockets
- In-House Developed PWM Controlled Pump
- High Performance allows Overclocking
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- Japanese brand dual ball bearing provides a longer life span
- Ideal for continuous operation with exceptional stability
- PWM Sharing Technology (PST)
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- Computer case Fan 14 cm 1900 RPM
- 68.9 cfm Fluid Dynamic Bearing (FDB)
- Pulse-width modulation (PWM) support
Ships in 8 days
IN STOCK - ships in 8 days
At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 8 days from your order.
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- Full flexibility in alignment
- Can be used in both landscape and portrait mode
- Gas lift arm for smooth, steady adjustment
Ships in 4 days
IN STOCK - ships in 4 days
At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 4 days from your order.
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- Reduced packaging with lower CO2 footprint
- Package contains 45g thermal compound with up to 8 years' durability
- 8.5 W/(mK) thermal conductivity / 870 poise viscosity
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- Convenient 25 gram syringe
- Uses only ceramic fillers so it is neither electrically conductive nor capacitive
- Allows thinnest possible bond line with processors, heatsinks and electronics
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- Compatible with Intel & AMD Sockets
- In-House Developed PWM Controlled Pump
- High Performance allows Overclocking
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- Compatible with Intel® & AMD® sockets
- Pre-applied MX-2 thermal paste
- Extra long life span thanks to dual ball bearing and low motor temperature
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- Processor Air cooler 9.2 cm 2000 RPM
- Supported processor sockets: LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 2066, LGA 771 (Socket J), LGA 775 (Socket T), Socket AM3+, Socket AM4, Socket FM1, Socket FM2+
- Fluid Dynamic Bearing (FDB)
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- Maximum weight capacity: 20 kg
- Minimum screen size: 33 cm (13") Maximum screen size: 109.2 cm (43")
- Number of displays supported: 1
Ships in 9 days
IN STOCK - ships in 9 days
At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 9 days from your order.
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- Single clamp monitor arm
- Compatible with monitors and TVs up to 34"/38" Ultrawide
- Swivels 180° and rotates 360° for optimum ergonomics
Ships in 8 days
IN STOCK - ships in 8 days
At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 8 days from your order.