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Noctua NT-H1 heat sink compound Thermal paste 3.5 g by Noctua


Noctua NT-H1 heat sink compound Thermal paste 3.5 g Image

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$22.81 No sales tax on OH orders
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Key Features

  • Thermal paste
  • 2.49 g/cm³
  • Grey
  • 1 pc(s)
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Details
SW (Spatula & Wipes) Edition
The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.

Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.

Excellent long-term stability
NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.

No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
Specifications
WEIGHT / VOLUME 3.5 g
OPERATING TEMPERATURE -50 - 110 °C
COLOR Grey
DENSITY 2.49 g/cm³
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