Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution.
| WEIGHT / VOLUME | 4g |
| THERMAL CONDUCTIVITY | 5.3 W/m·K |
| OPERATING TEMPERATURE | -30 - 250 °C |
